Is there any benefit from chamfering the base of plain based boolits used to make up paper patched loads? When I swage an as cast .311" boolit down to say .3015" to allow patching, I have noticed a fin of lead around the base which is sometimes formed. I felt this would be a problem, so I chucked the boolits in a cordless drill and touched the bases with a small file to remove the fin(s). Problem was, I couldn't get the chamfers the same size from one boolit to the next. Wondered if I was doing more damage than good. Anyone else run into this?