The company I work for has a 40 pound hot solder pot for solder dipping some of the assemblies we make. It is not used every day, but it is used regularly. The pot is left on 7 days a week, 24 hours a day. I know that this pot has been in operation having ONLY new solder added to it as needed for over a year. The temperature is held well above 750F.
The solder is 60% Tin, 40% Lead.
We were looking into the requirements for a new customer who was requesting a Military-Specification on the solder used and the solder dipping of the part. In order to confirm the contents of the pot Vs. the contents of our solder bars, I sent samples to the solder manufacturer to analyse. (I melted the new bar and poured a sample from it.) The samples were only labeled "A" and "B".
The results:
Sample "Pot"
Tin 60.40
Lead 38.55
Copper 0.107
Silver 0.810
Sample "Bar"
Tin 59.20
Lead 40.54
Coppe 0.024
Silver 0.0055
The rest of the elements reported were only at contaminate levels. The higher content of Copper and Silver are from the parts that we are solder dipping.
My conclusion from this test (for us bullet crafters) is that we are probably over stressing about losing Tin in our pots. It is highly unlikely that we are losing significant amounts of Tin during a casting session, if any at all.
BNE